Texas Instruments LM1875T/LF02 IC AMP AUD PWR 20W MONO TO220-5
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PCN Assembly/Origin Mult Devices 21/Aug/2017
Online Catalog Class AB Amplifier
Categories Integrated Circuits (ICs)
Linear - Amplifiers - Audio
Manufacturer Texas Instruments
Series-
Packaging Tube
Part Status Active
Type Class AB
Output Type 1-Channel (Mono)
Max Output Power x Channels @ Load 25W x 1 @ 8 Ohm
Voltage - Supply 16 V ~ 60 V, ±8 V ~ 30 V
Features Short-Circuit and Thermal Protection
Mounting Type Through Hole
Operating Temperature 0°C ~ 70°C (TA)
Supplier Device Package TO-220-5
Package / Case TO-220-5 Formed Leads
Base Part Number LM1875
The LM1875 has a sophisticated thermal protection scheme to prevent long-term thermal stress to the device. When the temperature on the die reaches 170°C, the LM1875 shuts down. It starts operating again when the die temperature drops to about 145°C, but if the temperature again begins to rise, shutdown will occur at only 150°C. Therefore, the device is allowed to heat up to a relatively high temperature if the fault condition is temporary, but a sustained fault will limit the maximum die temperature to a lower value. This greatly reduces the stresses imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Since the die temperature is directly dependent upon the heat sink, the heat sink should be chosen for thermal resistance low enough that thermal shutdown will not be reached during normal operation. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device.
Featured Product Create your power design now with TI’s WEBENCH® Designer
PCN Assembly/Origin Mult Devices 21/Aug/2017
Online Catalog Class AB Amplifier
Categories Integrated Circuits (ICs)
Linear - Amplifiers - Audio
Manufacturer Texas Instruments
Series-
Packaging Tube
Part Status Active
Type Class AB
Output Type 1-Channel (Mono)
Max Output Power x Channels @ Load 25W x 1 @ 8 Ohm
Voltage - Supply 16 V ~ 60 V, ±8 V ~ 30 V
Features Short-Circuit and Thermal Protection
Mounting Type Through Hole
Operating Temperature 0°C ~ 70°C (TA)
Supplier Device Package TO-220-5
Package / Case TO-220-5 Formed Leads
Base Part Number LM1875
The LM1875 has a sophisticated thermal protection scheme to prevent long-term thermal stress to the device. When the temperature on the die reaches 170°C, the LM1875 shuts down. It starts operating again when the die temperature drops to about 145°C, but if the temperature again begins to rise, shutdown will occur at only 150°C. Therefore, the device is allowed to heat up to a relatively high temperature if the fault condition is temporary, but a sustained fault will limit the maximum die temperature to a lower value. This greatly reduces the stresses imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Since the die temperature is directly dependent upon the heat sink, the heat sink should be chosen for thermal resistance low enough that thermal shutdown will not be reached during normal operation. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device.
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